RSP, Singapore and Digital Twin Solution Provider, Neilsoft Partnered to Win First Place at Autodesk Digital Twin & AI Hackathon in Singapore
Feb 09, 2026
Pune (Maharashtra) [India], February 9: Neilsoft Limited and RSP Architects Planners & Engineers (Pte) Ltd, Singapore, won the First place at the Autodesk Tandem & AI Hackathon in Singapore. This was a highly competitive field, with participation from several leading organizations from Singapore and Malaysia. The jury comprised of Mr. Ivy Rayner (Managing Director, Autodesk SEA), Mr. Frank Ngoh (President, IFMA), and Derek Yoh (Chief Technology office CBM Pte Ltd), making this recognition particularly meaningful.