Sanand (Gujarat) [India], July 4 : Prime Minister Narendra Modi on Saturday inaugurated the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Gujarat's Sanand, highlighting India's growing momentum in semiconductor manufacturing and its vision to become a global chip hub.
Addressing the event here, the Prime Minister said he was confident the facility would soon achieve its production target.
He said, "I've been told that 200 million chips will be produced here every year from now on. I am firmly confident that you will achieve it soon. This confidence also stems from the fact that the Semicon India programme is gaining momentum. STEP BY STEP, BRICK BY BRICK, and now CHIP BY CHIP. We have set a target of manufacturing 500 million chips annually. I am confident that you will achieve this target very soon. I extend my heartfelt congratulations to the entire team at CG Semi."
PM Modi said India has become the world's second-largest mobile manufacturer and exporter, with electronic production rising nearly seven times and electronics exports increasing about eleven times since 2014.
"Today, India is the world's second-largest mobile manufacturer and also the second-largest mobile exporter. Today, India's total electronic production has increased by nearly 7 times compared to 2014. Electronics exports have increased by nearly 11 times," he said.
PM Modi said that India's semiconductor growth is not sudden but part of a decade-long electronics revolution. He explained that India is now moving from finished products to components and finally to semiconductors, aiming to build the entire electronics value chain within the country. He described this as a key step in the roadmap for a developed India and the next phase of the 'Make in India' initiative.
"The expansion of the semiconductor industry in India did not happen suddenly. This is the next step of the electronics revolution that has come to India over the past decade. First Product, then Components, and now Semiconductor. Meaning the entire 'VALUE CHAIN of ELECTRONICS' will be in India. This is the roadmap for a developed India. This is the next phase of Make in India," he said.
Highlighting India's semiconductor ambitions, PM Modi said, "Five years ago, India resolved that we would make the country a semiconductor hub. We have moved forward with the mantra of Design in India, 'Make in India', and today, commercial production of chip packaging is also starting in the country's third semiconductor plant."
Recalling the project timeline, he added, "I had the opportunity to lay the foundation stone of this plant in 2024. In August 2025, the testing chip work began here, and today the inauguration of this plant has taken place. This journey from foundation stone to production is undoubtedly the result of the hard work of many colleagues."
Emphasising global collaboration, the Prime Minister said, "This CG Semi plant is also a symbol of the collective efforts of our industry partners from India, Japan, and Thailand. This is not just a business venture; it is a model of technology, trust, and partnership that will give new momentum to India's semiconductor journey."